An investigation of bonding mechanism for Au-Al solid-phase diffusion flip chip bonding

1997 ◽  
Vol 80 (10) ◽  
pp. 9-17
Author(s):  
Yumi Fukuda ◽  
Atsuko Iida ◽  
Yukio Kizaki ◽  
Miki Mori
Keyword(s):  
Flip Chip ◽  
Solid Phase ◽  
Bonding Mechanism ◽  
Phase Diffusion ◽  
Flip Chip Bonding

The Study of Initial Mechanism for Al–Au Solid Phase Diffusion Flip-chip Bonding

1997 ◽  
Vol 36 (Part 1, No. 6A) ◽  
pp. 3655-3661 ◽  
Author(s):  
Atsuko Iida ◽  
Shin-ichi Nakamura
Keyword(s):  
Flip Chip ◽  
Solid Phase ◽  
Phase Diffusion ◽  
Flip Chip Bonding

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding
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